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MC33PF8200DBES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200DBES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 538
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT

MC33PF8200DBES Overview


Shipments can be made in the direction of Tray .A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.The power management operates at 2.5V~5.5V volts.The IC has been praised a lot for its capability of being a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.

MC33PF8200DBES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200DBES Applications


There are a lot of NXP USA Inc. MC33PF8200DBESPower Management applications.

  • Portable Media Players
  • Netbooks
  • Printers
  • System Health Prognostics
  • Telecom Rectifiers
  • Communications payload
  • Storage Systems
  • Hand-Held Systems
  • LP2996A: DDR3
  • Tablet PCs