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MC33PF8200DFES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200DFES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 797
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant

MC33PF8200DFES Overview


Tray is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method allows for easy adaptation.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA to prevent malfunctions.The power management operates at 2.5V~5.5V volts.The instruments designs is highly regarded as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8200DFES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200DFES Applications


There are a lot of NXP USA Inc. MC33PF8200DFESPower Management applications.

  • Portable Media Players
  • Communications payload
  • Memory Power
  • FPGA, DSP Core Power
  • Standard notebook PC
  • SSTL-2 Termination
  • Data Storage
  • Isolated DC-DC Modules
  • Office Electronics
  • Motherboard