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MC33PF8200DFESR2

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200DFESR2
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 269
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant

MC33PF8200DFESR2 Overview


The way of Tape & Reel (TR) is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.Applications targeting this power management include High Performance i.MX 8, S32x Processor Based and others.Ideally, the operating temperature of the power management ic should be set at -40°C~105°C TA in order to prevent malfunction.2.5V~5.5V voltage is used for the operation of this power management.This analog IC has received a great deal of praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.

MC33PF8200DFESR2 Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200DFESR2 Applications


There are a lot of NXP USA Inc. MC33PF8200DFESR2Power Management applications.

  • FPGA
  • Industrial applications
  • Automotive Navigation Systems
  • Chromebook
  • Hand-Held Systems
  • DSP
  • Wireless routers
  • Netbooks
  • Printers
  • Electronic Test Equipment