Products
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Width | Mounting Type | Operating Temperature | Technology | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Applications | Supply Current-Max (Isup) | Interface IC Type | Built-in Protections | Output Current Flow Direction | Adjustable Threshold | Turn On Time | Telecom IC Type | Voltage - Supply | Output Peak Current Limit-Nom | Turn Off Time |
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MC34FS6408NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tray | 2015 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 13mA | 8542.39.00.01 | NOT SPECIFIED | NOT SPECIFIED | System Basis Chip | ETHERNET TRANSCEIVER | 2.7V~36V | ||||||||||||||||||||||||||||||||||||
MC34PF8100EQEPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||
MC33FS4501CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6513CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6523NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MWCT1011VLH | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | Active | 64-LQFP | Surface Mount | -40°C~105°C TA | 8542.39.00.01 | General Purpose | TELECOM CIRCUIT | 2.7V~3.6V | ||||||||||||||||||||||||||||||||||||||||||||
MC33FS6512NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC35FS6510NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC35FS6502CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS4503NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS4500NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS4503CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33PF8200A0ESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||
MC33PF8200DFESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||
MC32PF8121F1EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount | -40°C~85°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | Industrial, IoT | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||
MC32PF3000A6EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~85°C | MOS | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | 260 | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 12 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | i.MX Processors | YES | 2.8V~5.5V | ||||||||||||||||||||
MC33FS6520NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC34912G5ACR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2003 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | MATTE TIN | QUAD | GULL WING | 260 | 13.5V | 40 | MC34912 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~18V | 0.11A | 10 µs | ||||||||||||||||
MC32PF4210A2ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | 0°C~85°C TA | 260 | 40 | POWER SUPPLY SUPPORT CIRCUIT | Audio, Video | 2.8V~4.5V | ||||||||||||||||||||||||||||||||||||||||
MC34PF1550A1EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||
MC34PF1550A6EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | ||||||||||||||||||||||||||||||||||||||||
MC34PF1550A8EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tray | Active | 3 (168 Hours) | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 4.1V~6V | |||||||||||||||||||||||||||||||||||||||||||
MC33PF3000A4ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~105°C | MOS | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | 260 | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 12 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | i.MX Processors | YES | 2.8V~5.5V | ||||||||||||||||||||
MC33FS4502NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MWCT1011CFM | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
13 Weeks | Tray | 2015 | Active | 3 (168 Hours) | 32 | ROHS3 Compliant | 32-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 8542.39.00.01 | 1 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | S-XQCC-N32 | General Purpose | TELECOM CIRCUIT | 2.7V~3.6V | ||||||||||||||||||||||||||||||||
MC13892CJVKR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 139 | EAR99 | 7mm | ROHS3 Compliant | 139-TFBGA | 7mm | Surface Mount | -40°C~85°C | 1.2mm | 8542.39.00.01 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.6V | 40 | MC13892 | YES | 0.5mm | S-PBGA-B139 | 1.8V | 1 | Power Management Circuits | Not Qualified | 3.6V | 3.6V | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | YES | ||||||||||||||||||
MC13892DJVKR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 139 | EAR99 | 7mm | ROHS3 Compliant | 139-TFBGA | 7mm | Surface Mount | -40°C~85°C | 1.2mm | 8542.39.00.01 | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.6V | 40 | MC13892 | YES | 0.5mm | S-PBGA-B139 | 1.8V | 1 | Power Management Circuits | Not Qualified | 3.6V | 3.6V | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | 1.5mA | YES | |||||||||||||||||
MC34PF1550A3EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||||||
MC32PF4210A3ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | 0°C~85°C TA | 260 | 40 | POWER SUPPLY SUPPORT CIRCUIT | Audio, Video | 2.8V~4.5V | ||||||||||||||||||||||||||||||||||||||||
MC33VR5500V0ESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) |
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