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MC33PF8200DHESR2

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200DHESR2
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 675
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT

MC33PF8200DHESR2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .For easy adaptation, Surface Mount, Wettable Flank is a universal mounting method.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.The power management runs on 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8200DHESR2 Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200DHESR2 Applications


There are a lot of NXP USA Inc. MC33PF8200DHESR2Power Management applications.

  • Applications Processors
  • SmartPhones
  • WOA
  • Automotive Infotainment
  • Automotive camera module
  • Office Electronics
  • Laser TV
  • Computing
  • Projection Mapping
  • Automotive Infotainment