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  • MC33PF8200ESES

MC33PF8200ESES

2.7V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200ESES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 937
  • Description: 2.7V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.7V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT

MC33PF8200ESES Overview


Tray is acceptable as a shipping the power management method.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.As a result, this power management is powered by 2.7V~5.5V voltage.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received much praise.

MC33PF8200ESES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200ESES Applications


There are a lot of NXP USA Inc. MC33PF8200ESESPower Management applications.

  • FPGA, DSP Core Power
  • Portable Navigation Devices
  • Electronic Test Equipment
  • FPGA
  • LP2996A: DDR3L
  • Surround view system ECU
  • Telecommunications Equipment
  • Portable Systems
  • Electronic Test Instrumentation
  • Applications Processors