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MC33PF8200ESESR2

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200ESESR2
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 474
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant

MC33PF8200ESESR2 Overview


Shipments can be made in the direction of Tape & Reel (TR) .The package is conveniently packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.The power management operates at 2.5V~5.5V volts.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8200ESESR2 Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200ESESR2 Applications


There are a lot of NXP USA Inc. MC33PF8200ESESR2Power Management applications.

  • Printers
  • Automotive camera module
  • Industrial applications
  • Computing
  • Server Backplane Systems
  • Industrial Equipment
  • Portable Media Players
  • Hearing Aids
  • Electronic Test Equipment
  • Digital Cores