Products
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Width | Mounting Type | Operating Temperature | Technology | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Qualification Status | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Applications | Interface IC Type | Built-in Protections | Output Current Flow Direction | Adjustable Threshold | Turn On Time | Telecom IC Type | Voltage - Supply | Output Peak Current Limit-Nom | Turn Off Time |
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MC34PF1550A6EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC33FS6521NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC33FS8430G0ESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||||||||
MC33FS6502CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC33FS4502LAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC32PF1510A4EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC32PF1550A0EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | ||||||||||||||||||||||||||||||||||||||
MC32PF1550A2EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | ||||||||||||||||||||||||||||||||||||||
MC32PF1510A7EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC34827A2EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
16 Weeks | Tape & Reel (TR) | 2006 | Active | 3 (168 Hours) | 20 | EAR99 | 4mm | ROHS3 Compliant | 20-UFQFN Exposed Pad | 3mm | Surface Mount | -40°C~85°C | 9μA | 0.6mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | 260 | 3.6V | 40 | MC34827 | YES | 0.5mm | R-XQCC-N20 | Not Qualified | OR Controller, UART/USB Data, Audio Management | INTERFACE CIRCUIT | 2.7V~5.5V | |||||||||||||||||||||
MC34PF1510A3EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC33911G5ACR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~125°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 13.5V | 40 | MC33911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||
MC32PF1550A3EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC32PF1510A6EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC34911BACR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 12 Weeks | Tape & Reel (TR) | 2004 | Active | 3 (168 Hours) | 32 | EAR99 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C | 4.5mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 13.5V | 40 | MC34911 | YES | 0.8mm | S-PQFP-G32 | Not Qualified | System Basis Chip | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | SOURCE SINK | 10 µs | 5.5V~27V | 0.11A | 10 µs | |||||||||||||
MC32PF1510A3EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC34PF1550A7EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | Surface Mount | -40°C~105°C | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | 3.8V~7V | |||||||||||||||||||||||||||||||||||||
MC33PF8200CXES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Tray | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||
MC33PT2000AFR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 18 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 80-LQFP Exposed Pad | Surface Mount | -40°C~125°C TA | 150μA | 8542.39.00.01 | NOT SPECIFIED | NOT SPECIFIED | ANALOG CIRCUIT | Automotive | 5V~72V | |||||||||||||||||||||||||||||||||||
MC35FS4502NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC33PF8200ESESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6514LAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC35FS6503NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||||||
MC33PF3000A7ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | ALSO OPERATES WITH 3.7V TO 5.5V; ALSO OPERATES WITH COIN CELL VOLTAGE OF 1.8 TO 4.5V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~105°C | MOS | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | 260 | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 12 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | i.MX Processors | YES | 2.8V~5.5V | |||||||||||||||||
MC33909N3ADR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | Surface Mount | -40°C~125°C | MOS | 7mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 40 | YES | 0.5mm | S-PQFP-G48 | 3.3V | 3 | 5V | POWER SUPPLY MANAGEMENT CIRCUIT | System Basis Chip | NO | 3.5V~28V | |||||||||||||||||||
MC33909D3AD | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tray | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | Surface Mount | -40°C~125°C | MOS | 7mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 40 | YES | 0.5mm | S-PQFP-G48 | 3.3V | 3 | 5V | POWER SUPPLY MANAGEMENT CIRCUIT | System Basis Chip | NO | 3.5V~28V | |||||||||||||||||||
MC33909D5AD | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tray | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | Surface Mount | -40°C~125°C | MOS | 7mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 40 | YES | 0.5mm | S-PQFP-G48 | 3.3V | 3 | 5V | POWER SUPPLY MANAGEMENT CIRCUIT | System Basis Chip | NO | 3.5V~28V | |||||||||||||||||||
MC33909D5ADR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | Surface Mount | -40°C~125°C | MOS | 7mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 40 | YES | 0.5mm | S-PQFP-G48 | 3.3V | 3 | 5V | POWER SUPPLY MANAGEMENT CIRCUIT | System Basis Chip | NO | 3.5V~28V | |||||||||||||||||||
MC33909L3AD | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
Tray | Obsolete | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-LQFP Exposed Pad | 7mm | Surface Mount | -40°C~125°C | MOS | 7mA | 1.6mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | GULL WING | 260 | 40 | YES | 0.5mm | S-PQFP-G48 | 3.3V | 3 | 5V | POWER SUPPLY MANAGEMENT CIRCUIT | System Basis Chip | NO | 3.5V~28V | |||||||||||||||||||
MC13892VKR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Tape & Reel (TR) | 2004 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 139-TFBGA | Surface Mount | -40°C~85°C | MC13892 | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply |
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