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MC33PF8201A0ESR2

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8201A0ESR2
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 512
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8 Processor Based
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA

MC33PF8201A0ESR2 Overview


The way of Tape & Reel (TR) is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.Applications targeting this power management include High Performance i.MX 8 Processor Based and others.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8201A0ESR2 Features


Mainly used in High Performance i.MX 8 Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8201A0ESR2 Applications


There are a lot of NXP USA Inc. MC33PF8201A0ESR2Power Management applications.

  • Printers
  • System Thermal for Servers
  • HSTL Termination
  • FPGA
  • Hearing Aids
  • Hand-Held Systems
  • System Health Monitoring
  • Projection Mapping
  • Radar system ECU
  • Chromebook