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MC68360ZQ33L

1.27mm CPU32+ Microprocessor M683xx Series MC68360 5V 357-BBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC68360ZQ33L
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: 832
  • Description: 1.27mm CPU32+ Microprocessor M683xx Series MC68360 5V 357-BBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 1995
Series M683xx
JESD-609 Code e0
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68360
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 33MHz
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Core Processor CPU32+
Clock Frequency 25MHz
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Bus Compatibility MC68040; MC68030
Data Transfer Rate-Max 1.25 MBps
Communication Protocol BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
Data Encoding/Decoding Method NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
Height Seated (Max) 1.86mm
Length 25mm
RoHS Status Non-RoHS Compliant

MC68360ZQ33L Overview


With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. A high level of reliability is provided by using an advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. Extended operating temperature around 0°C~70°C TA. In the M683xx series, it is found. Core-wise, this CPU has a CPU32+ processor. A CPU with this architecture uses DRAM RAM controllers. A SCC, SMC, SPI interface has been added to this microprocessor in order to serve the user better. There is 5.0V I/O running on this CPU. The type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL belongs to uPs/uCs/Peripheral ICs. Using MC68360 will help you find variants of the cpu microprocessor. There are 357 terminations totally. You should be able to turn on and run the embedded microprocessor with a voltage supply of 5V. Supply current is maximum at 5.25V. The external data bus width of this CPU is 32. CPU microprocessor clock frequency is 25MHz.

MC68360ZQ33L Features


CPU32+ Core

MC68360ZQ33L Applications


There are a lot of NXP USA Inc. MC68360ZQ33L Microprocessor applications.

  • Set-top boxes
  • Microwave ovens
  • Ipad
  • Guidance-GPS
  • Embedded gateways
  • Industrial instrumentation devices
  • PDAs, game consoles
  • Security systems
  • Dishwashers
  • Safety -airbags, automatic braking system (ABS)