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  • MC68MH360ZQ25VL

MC68MH360ZQ25VL

1.27mm CPU32+ Microprocessor M683xx Series MC68MH360 5V 357-BBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC68MH360ZQ25VL
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: 107
  • Description: 1.27mm CPU32+ Microprocessor M683xx Series MC68MH360 5V 357-BBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 1997
Series M683xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A991
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68MH360
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 5.25V
Supply Voltage-Min (Vsup) 4.75V
Speed 25MHz
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Core Processor CPU32+
Clock Frequency 25MHz
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
Bus Compatibility MC68040; MC68030
Data Transfer Rate-Max 1.25 MBps
Communication Protocol BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP
Data Encoding/Decoding Method NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL
Height Seated (Max) 1.86mm
Length 25mm
RoHS Status Non-RoHS Compliant

MC68MH360ZQ25VL Overview


With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved using advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Identify the operating temperature around 0°C~70°C TA. It comes from the M683xx series. The CPU is cored by a processor with a number of 0 cores. There are DRAM RAM controllers on this CPU. To serve better this microprocessor features SCC, SMC, SPI interfaces. I/O is run at 3.3V on this CPU. This is a SERIAL IO/COMMUNICATION CONTROLLER, SERIAL for the uPs/uCs/Peripheral ICs type. Search MC68MH360 for variants of the embedded microprocessor. The total number of terminations is 357. You should be able to turn on and run the embedded microprocessor with a voltage supply of 5V. With a maximum supply current of 5.25V, it has a maximum power consumption. The external data bus width of this CPU is 32. The embedded microprocessor has a clock frequency of 25MHz.

MC68MH360ZQ25VL Features


CPU32+ Core

MC68MH360ZQ25VL Applications


There are a lot of NXP USA Inc. MC68MH360ZQ25VL Microprocessor applications.

  • Hard drives
  • Hearing aids
  • Multi-meter
  • Dialysis machines (performs function of liver)
  • DVD\DV\MP3 players
  • Toasters
  • Torpedo guidance
  • Electronic jamming systems
  • Fire alarms
  • Projectors