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The following are some common countries' logistic time.Parameters | |
---|---|
Factory Lead Time | 12 Weeks |
Mounting Type | Surface Mount |
Package / Case | 196-LBGA |
Surface Mount | YES |
Operating Temperature | -40°C~85°C TA |
Packaging | Tray |
Published | 2006 |
Series | MCF5227x |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 196 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Subcategory | Microprocessors |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.5V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | MCF52277 |
JESD-30 Code | S-PBGA-B196 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 1.6V |
Power Supplies | 1.51.82.53.3V |
Supply Voltage-Min (Vsup) | 1.4V |
Oscillator Type | External |
Number of I/O | 55 |
Speed | 166.67MHz |
RAM Size | 128K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.4V~1.6V |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | Coldfire V2 |
Peripherals | DMA, LCD, PWM, WDT |
Clock Frequency | 66.67MHz |
Program Memory Type | ROMless |
Core Size | 32-Bit |
Connectivity | CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG |
Supply Current-Max | 0.7mA |
Bit Size | 32 |
Address Bus Width | 24 |
Boundary Scan | YES |
Low Power Mode | NO |
External Data Bus Width | 32 |
Format | FIXED POINT |
Integrated Cache | YES |
Height Seated (Max) | 1.7mm |
Length | 15mm |
Width | 15mm |
RoHS Status | ROHS3 Compliant |
MCF52277CVM160 microcontroller features several devices featuring peripheral sets targeted for a large number of applications. MCF52277CVM160 datasheet is an excellent option for a variety of extensive hardware and software ecosystem. NXP USA Inc. MCF52277CVM160 is suitable for Smart Power Socket and Light Switch, Motorcycle Engine Control Unit, Input Device, Smart Watch, and Wireless Charging Pad.
For space savings, it is available in the 196-LBGA package.Using Surface Mount, it is mounted.You can find it in the package of Tray.Coldfire V2 core processor is present on the device.Work should be done at -40°C~85°C TA.Memory type ROMless is used for program memory.There are 55 I/Os on it.Other components that are comparable to it have the base part number MCF52277.BOTTOM is the location of its terminals.It has 196 terminations.There are a number of electrical components in the MCF5227x series, including this one.High efficiency is possible due to the 1.5V supply voltage.MICROPROCESSOR, RISC is this gadget's uPs/uC/peripheral IC.This component is a part of Microprocessors.In this case, 0.7mA represents the maximum current supply.Powered by a 1.51.82.53.3V source.In the device, there is a clock running at 66.67MHz.In order to maintain normal operation, the supply voltage (Vsup) should be maintained above 1.4V.There is an oscillator type External used in this circuit.
196-LBGA package
Mounting type of Surface Mount
Microprocessors subcategory
There are a lot of NXP USA Inc. MCF52277CVM160 Microcontroller applications.
ECG machine
Laminators
Hearing aids
Robots
Information appliances (networking of household appliances)
Fax machines
Xbox
Industrial instrumentation devices
Light sensing & controlling devices
Home video and audio
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