All Products

MCIMX6QP5EYM1AB

ARM? Cortex?-A9 Microprocessor i.MX6QP Series 624-LFBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MCIMX6QP5EYM1AB
  • Package: 624-LFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 920
  • Description: ARM? Cortex?-A9 Microprocessor i.MX6QP Series 624-LFBGA, FCBGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 15 Weeks
Package / Case 624-LFBGA, FCBGA
Operating Temperature -20°C~105°C TJ
Packaging Tray
Published 2002
Series i.MX6QP
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1.0GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3L, DDR3
USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant

MCIMX6QP5EYM1AB Overview


Packed in 624-LFBGA, FCBGA, the microprocessor is convenient for shipping overseas. High reliability can be achieved by using the advanced packaging method Tray. In the CPU, there are 4 Core 32-Bit cores and 4 Core 32-Bit bus width. The operating temperature around -20°C~105°C TJ should be understood. The i.MX6QP series contains it. The CPU is powered by a ARM? Cortex?-A9 core. The CPU uses LPDDR2, DDR3L, DDR3 RAM controllers. This microprocessor features CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces to better serve its users. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V.

MCIMX6QP5EYM1AB Features


ARM? Cortex?-A9 Core

MCIMX6QP5EYM1AB Applications


There are a lot of NXP USA Inc. MCIMX6QP5EYM1AB Microprocessor applications.

  • Industrial instrumentation devices
  • Day to day life field
  • Digital cameras
  • Copiers
  • Dishwashers
  • DVD\DV\MP3 players
  • Mice
  • Removable disks
  • Magnetic resonance imaging (MRI)
  • Fabric