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  • MK64FN1M0VDC12

MK64FN1M0VDC12

1MB 1M x 8 FLASH ARM? Cortex?-M4 32-Bit Microcontroller Kinetis K60 Series 3.3V 121-XFBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MK64FN1M0VDC12
  • Package: 121-XFBGA
  • Datasheet: -
  • Stock: 466
  • Description: 1MB 1M x 8 FLASH ARM? Cortex?-M4 32-Bit Microcontroller Kinetis K60 Series 3.3V 121-XFBGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 121-XFBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series Kinetis K60
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 121
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B121
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Number of I/O 83
Speed 120MHz
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1MB 1M x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Data Converter A/D 37x16b; D/A 2x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
RoHS Status ROHS3 Compliant

MK64FN1M0VDC12 MCU Description


In an ultra-small packaging, the MK64FN1M0VDC12 provides high memory density, low power consumption, and optimal integration. It has the same comprehensive enablement and scalability as the Kinetis family. In addition, the MCU offers a full-retention low-power mode of 6 a with a wake-up time of 5 s, a run current of 250 a/MHz when executing from Flash, and is cost-optimized with new USB crystal-less capability.


MK64FN1M0VDC12 MCU Features


Performance
? Up to 120 MHz ARM? Cortex?-M4 core with DSP
instructions and floating-point unit
Memories and memory interfaces
? Up to 1 MB program flash memory and 256 KB RAM
? upto 128 KB FlexNVM and 4 KB FlexRAM on devices
with FlexMemory
? FlexBus external bus interface
System peripherals
? Multiple low-power modes, low-leakage wake-up unit
? Memory protection unit with multi-master protection
? External watchdog monitor and software watchdog
? 16-channel DMA controller
Security and integrity modules
? Hardware CRC module
? Hardware random-number generator
? Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
? 128-bit unique identification (ID) number per chip
Analog modules
? Two 12-bit DACs
? Voltage reference
? Two 16-bit SAR ADCs
? Three analog comparators (CMP)
Communication interfaces
? Three SPI modules
? I2S module
? Three I2C modules. Support for up to 1 Mbit/s
? Secure Digital Host Controller (SDHC)
? Controller Area Network (CAN) module
? Six UART modules
? USB full-/low-speed On-the-Go controller
? Ethernet controller with MII and RMII interface
Timers
? Two 2-channel FlexTimers (PWM/Quad decoder)
? Real-time clock
? programmable delay block
? Two 8-channel Flex-Timers (PWM/Motor control)
? IEEE 1588 timers
? 32-bit PITs and 16-bit low-power timers
Clocks
? 48 MHz Internal Reference Clock (IRC48M)
? PLL, FLL, and multiple internal oscillators
? 3 to 32 MHz and 32 kHz crystal oscillator
Operating Characteristics
? Temperature range (ambient): –40 to 105°C
? Flash write voltage range: 1.71 to 3.6 V
? Voltage range: 1.71 to 3.6 V



MK64FN1M0VDC12 MCU Applications


Avionics
Major Home Appliances
Defibrillator
Smart Power Socket and Light Switch
Motion Control and Robotics
Motor Drives
POS Terminal
Robotic Appliance