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MM60-52B1-E1-R650
Purchase
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 16 Weeks |
| Contact Material | Copper Alloy |
| Mount | Surface Mount |
| Mounting Type | Surface Mount, Right Angle |
| Housing Material | Plastic |
| Material - Insulation | Thermoplastic |
| Manufacturer Package Identifier | MM60-52B1-E1-R650 |
| Operating Temperature | -40°C~85°C |
| Packaging | Cut Tape (CT) |
| Published | 2006 |
| Series | MM60 |
| Feature | Board Guide |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | Socket |
| Number of Positions | 52 |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.031 0.80mm |
| Current Rating | 500mA |
| Contact Finish | Gold |
| Contact Resistance | 55mOhm |
| Card Type | PCI Express Mini Card |
| Read Out | Dual |
| Row Spacing | 800 μm |
| Height | 5.9mm |
| Length | 25mm |
| Width | 10mm |
| Contact Finish Thickness | 3.94μin 0.10μm |
| Card Thickness | 0.039 1.00mm |
| REACH SVHC | Unknown |
| RoHS Status | RoHS Compliant |
| Flammability Rating | UL94 V-0 |
MM60-52B1-E1-R650 Overview
Packaging was done to Cut Tape (CT)'s specifications.A mounting type of Surface Mount, Right Angle is recommended.The device is connected by using the connector socket Socket.There are Board Guide features on the device.MM60 indicates the device's series number.
MM60-52B1-E1-R650 Features
MM60 series
MM60-52B1-E1-R650 Applications
There are a lot of JAE Electronics MM60-52B1-E1-R650 Edgeboard Connectors applications.
- CMOS Image sensors for mobile applications
- Digital beam-forming systems for ultrasound
- RADAR processing, digital oscilloscopes
- Music recording
- Automotive
- Multiplexed Data Acquisition Systems
- Broadband data applications
- Spectrum Analysis
- Micro and pico cell systems, software radios
- Battery Operated Systems