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MPC8260ACZUMHBB

1.27mm PowerPC G2 32-bit Microprocessor MPC82xx Series PC8260 2V 480-LBGA Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MPC8260ACZUMHBB
  • Package: 480-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 992
  • Description: 1.27mm PowerPC G2 32-bit Microprocessor MPC82xx Series PC8260 2V 480-LBGA Exposed Pad (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 480-LBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 1994
Series MPC82xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 480
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number PC8260
JESD-30 Code S-PBGA-B480
Supply Voltage-Max (Vsup) 2.2V
Supply Voltage-Min (Vsup) 1.9V
Speed 266MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC G2
Clock Frequency 66.66MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode NO
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
Height Seated (Max) 1.65mm
Length 37.5mm
RoHS Status Non-RoHS Compliant

MPC8260ACZUMHBB Description


The MPC8260ACZUMHBB PowerQUICC? II? is an advanced integrated communications processor designed for the telecommunications and networking markets. The MPC8260ACZUMHBB now offers floating point support. The MPC8260ACZUMHBB PowerQUICC II can best be described as the next generation MPC860 PowerQUICC?, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.

Like the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI), and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.



MPC8260ACZUMHBB Features


  • 190 MIPS at 100 MHz (Dhrystone 2.1)

  • 505 MIPS at 266 MHz (Dhrystone 2.1)

  • 570 MIPS at 300 MHz (Dhrystone 2.1)

  • High-performance, superscalar microprocessor

  • Disable CPU mode

  • Supports the NXP? external L2 cache chip (MPC2605)

  • Improved low-power core

  • 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative

  • Memory Management Unit

  • Floating point unit enabled

  • Common on-chip processor (COP)



MPC8260ACZUMHBB Applications


  • Communications equipment 

  • Broadband fixed line access 

  • Industrial 

  • Appliances 

  • Personal electronics 

  • PC & notebooks