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  • MPC850DECZQ66BU

MPC850DECZQ66BU

1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC850 3.3V 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MPC850DECZQ66BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 781
  • Description: 1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC850 3.3V 256-BBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Speed 66MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Height Seated (Max) 2.54mm
Length 23mm
RoHS Status Non-RoHS Compliant
Package / Case 256-BBGA
Surface Mount YES
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code 5A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM

MPC850DECZQ66BU Overview


Since the microprocessor is packed in 256-BBGA, shipping overseas is convenient. High reliability is achieved by using advanced packaging methods Tray. CPUs have 1 Core 32-Bit cores/bus width. Understand how the operating temperature around -40°C~95°C TA is determined. MPC8xx is its series number. There are DRAM RAM controllers used by this CPU. With its HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. At 3.3V, the CPU runs its I/O. This is a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. Use MPC850 when searching for variants of the embedded microprocessor. Total terminations are 256. Turn on the cpu microprocessor and let it run with a 3.3V voltage supply. 32-Bit is its architecture. A maximum supply current of 3.6V is available. The embedded microprocessor is a typical Microprocessors. 32 is the width of the external data bus on this CPU. Datasheets specify that the embedded microprocessor requires 3.3V power supplies.

MPC850DECZQ66BU Features


32-Bit Structure

MPC850DECZQ66BU Applications


There are a lot of NXP USA Inc. MPC850DECZQ66BU Microprocessor applications.

  • Light sensing & controlling devices
  • ECG machine
  • Wastewater treatment
  • Guidance-GPS
  • Scanners
  • Entertainment products
  • Switches
  • Network application field
  • Agriculture, transportation field
  • Smart highways (navigation, traffic control, information monitoring and car service)