All Products

MPC8533VTALF

PowerPC e500v2 Microprocessor MPC85xx Series MPC8533 783-BBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MPC8533VTALF
  • Package: 783-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 778
  • Description: PowerPC e500v2 Microprocessor MPC85xx Series MPC8533 783-BBGA, FCBGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 783-BBGA, FCBGA
Operating Temperature 0°C~90°C TA
Packaging Tray
Published 2006
Series MPC85xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Base Part Number MPC8533
Speed 667MHz
Core Processor PowerPC e500v2
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
Additional Interfaces DUART, HSSI, I2C, PCI
RoHS Status ROHS3 Compliant

MPC8533VTALF Description

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC8533E. This device is currently targeted to these specifications. Some of these specifications are independent of the I/O cell but are included for a more complete reference. These are not purely I/O buffer

design specifications.



MPC8533VTALF Features

256-Kbyte L2 cache/SRAM

— Flexible configuration

— Full ECC support on the 64-bit boundary in both cache and SRAM modes

— Cache mode supports instruction caching, data caching, or both.

— External masters can force data to be allocated into the cache through programmed memory

ranges or special transaction types (stashing).

– 1, 2, or 4 ways can be configured for stashing only.

— Eight-way set-associative cache organization (32-byte cache lines)

— Supports locking the entire cache or selected lines. Individual line locks are set and cleared through

Book E instructions or externally mastered transactions.

— Global locking and flash clearing are done through writes to L2 configuration registers

— Instruction and data locks can be flash cleared separately.

— SRAM features include the following:

– I/O devices access SRAM regions by marking transactions as snoopable (global).

– Regions can reside at any aligned location in the memory map.

– Byte-accessible ECC is protected using read-modify-write transaction accesses for

smaller-than-cache-line accesses.

Address translation and mapping unit (ATMU)

— Eight local access windows define mapping within local 36-bit address space.

— Inbound and outbound ATMUs map to larger external address spaces.

– Three inbound windows plus a configuration window on PCI and PCI Express

– Four outbound windows plus default translation for PCI and PCI Express