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  • MPC860ENZQ66D4

MPC860ENZQ66D4

1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MPC860ENZQ66D4
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: 445
  • Description: 1.27mm 3.3V 32-bit Microprocessor MPC8xx Series MPC860 3.3V 357-BBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Base Part Number MPC860
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 66MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 50MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (4)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Height Seated (Max) 2.52mm
Length 25mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 8 Weeks
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 1999
Series MPC8xx
JESD-609 Code e0
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30

MPC860ENZQ66D4 Overview


The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. In order to provide high reliability, advanced packaging method Tray is used. 1 Core 32-Bit cores/Bus width are present in the CPU. The operating temperature around 0°C~95°C TA should be understood. It comes from the MPC8xx series. There are DRAM RAM controllers used by this CPU. This microprocessor features I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. 3.3V is the CPU's I/O address. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR, RISC. The microprocessor can be searched for with MPC860 if you are looking for variants. Overall, there are 357 terminations. Turn on the cpu microprocessor and let it run with a 3.3V voltage supply. There are 32 bits in its architecture. 3.465V is its maximum supply current. The cpu microprocessor Microprocessors is typical. This CPU has a wide external data Bus width of 32. CPU microprocessor clock frequency is 50MHz. In the datasheet, 3.3V power supplies are required for this embedded microprocessor.

MPC860ENZQ66D4 Features


32-Bit Structure

MPC860ENZQ66D4 Applications


There are a lot of NXP USA Inc. MPC860ENZQ66D4 Microprocessor applications.

  • Washing machine
  • Paper shredders
  • PDAs, game consoles
  • Virtual reality VR robots
  • Laminators
  • Playstation
  • Removable disks
  • Hand-held metering systems
  • Television
  • Communication-bluetooth, Wi-Fi, radio