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MSC8103M1200F
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Shipping Cost
Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The
basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and
country.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~75°C TJ |
| Packaging | Tray |
| Published | 2004 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Base Part Number | MSC8103 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 300MHz |
| RoHS Status | Non-RoHS Compliant |
MSC8103M1200F Overview
Basically, it is a type of electronic component that is available in a 332-BFBGA, FCBGA package.Tray packaging is provided for it.With its association with SC140 Core, it is suitable for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.It is important that the device is operated at a temperature of -40°C~75°C TJ in order to ensure its normal functioning.The analog voltage range of 3.30V refers to the input or output voltage.StarCore series digital signal processors contain this digital signal processor.Based on its base part number of MSC8103, many ralated parts can be found.
MSC8103M1200F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8103M1200F Applications
There are a lot of NXP USA Inc. MSC8103M1200F DSP applications.
- Fourier transform
- Tomography technology
- Scene analysis technology
- Automatic analysis system of EEG or ECG
- Machinery and equipment
- Seismology
- Infrared
- Smart camera
- Electronic information engineering
- Telephone conversations