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MSC8103VT1100F

CPLD StarCore Series MSC8103 332-BFBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MSC8103VT1100F
  • Package: 332-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 421
  • Description: CPLD StarCore Series MSC8103 332-BFBGA, FCBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature -40°C~105°C TJ
Packaging Tray
Published 2008
Series StarCore
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Reach Compliance Code unknown
Base Part Number MSC8103
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate 275MHz
RoHS Status ROHS3 Compliant

MSC8103VT1100F Overview


In electronic terms, it is a type of component that comes in the package of type 332-BFBGA, FCBGA .The packaging way is Tray.With its association with SC140 Core, it is suitable for a wide range of applications.The device is attached in a way that faces Surface Mount.If it is operating at the temperature of -40°C~105°C TJ, then it will be operating normally.This refers to the analog voltage range that can be input or output from 3.30V.The StarCore series contains this digital signal processor.The base part number MSC8103 can be used to identify many associated parts.

MSC8103VT1100F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8103VT1100F Applications


There are a lot of NXP USA Inc. MSC8103VT1100F DSP applications.

  • Monitoring equipment
  • Electronic information engineering
  • Image signal processing
  • Smart camera
  • Fourier transform
  • Voice recognition
  • Tomography technology
  • Digital camera
  • Digital communications
  • Scene analysis technology