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  • MT8888CSR1

MT8888CSR1

20 TerminationsTelecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-MT8888CSR1
  • Package: 20-SOIC (0.295, 7.50mm Width)
  • Datasheet: PDF
  • Stock: 919
  • Description: 20 TerminationsTelecom device1 Circuits(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
ECCN Code EAR99
Terminal Finish MATTE TIN
Subcategory Telecom Signaling Circuits
Technology CMOS
Voltage - Supply 4.75V~5.25V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G20
Function DTMF Transceiver
Qualification Status Not Qualified
Power Supplies 5V
Number of Circuits 1
Current - Supply 7mA
Telecom IC Type DTMF SIGNALING CIRCUIT
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status ROHS3 Compliant

MT8888CSR1 Overview


A 20-SOIC (0.295, 7.50mm Width) package saves space on a board.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.There are 1 circuits in this telecom IC .When the voltage for 4.75V~5.25V is provided, improved efficiency can be achieved.Using -40°C~85°C as the operating temperature can result in reliable performance.There are 20 terminations can be found in telecom switching configuration.With 5V as the supply voltage, it operates.As its telecom IC type, it uses DTMF SIGNALING CIRCUIT.An electric current of 7mA is supplied to telecom equipment .Telecom Signaling Circuits subcategories telecommunications device .

MT8888CSR1 Features


Available in the 20-SOIC (0.295, 7.50mm Width) package
DTMF SIGNALING CIRCUIT as telecom IC type

MT8888CSR1 Applications


There are a lot of Microchip Technology MT8888CSR1 Telecom applications.

  • Cable PC
  • Wireless base stations
  • CSU/DSU E1 Interface
  • T3 channelized access concentrators
  • Remote wireless modules
  • Wireless local loop (WLL)
  • Integrated Access Devices
  • CSU/DSU Equipment
  • SDH Multiplexers
  • PCM channel bank