English

All Products

View All >>
  • MVF30NS152CKU26

MVF30NS152CKU26

0.5mm ARM? Cortex?-A5 32-bit Microprocessor Vybrid, VF3xx Series 3.3V 176-LQFP Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MVF30NS152CKU26
  • Package: 176-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 946
  • Description: 0.5mm ARM? Cortex?-A5 32-bit Microprocessor Vybrid, VF3xx Series 3.3V 176-LQFP Exposed Pad (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 15 Weeks
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Series Vybrid, VF3xx
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Speed 266MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-A5
Clock Frequency 24MHz
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels NO
Voltage - I/O 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3, DRAM
USB USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU
Length 24mm
RoHS Status ROHS3 Compliant

MVF30NS152CKU26 Overview


The embedded microprocessor ships overseas conveniently packed in 176-LQFP Exposed Pad. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores/bus width on the CPU. K-40°C~85°C TAw what the operating temperature is around -40°C~85°C TA. In the Vybrid, VF3xx series, it is found. A ARM? Cortex?-A5 processor powers this CPU. The CPU contains LPDDR2, DDR3, DRAM RAM controllers. To serve better this microprocessor features CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART interfaces. 3.3V is the CPU's I/O address. It is a MICROCONTROLLER, RISC in terms of uPs/uCs/Peripheral ICs. Total terminations are 176. When the voltage supply is 3.3V, the cpu microprocessor should be powered on and run. 32-Bit is its architecture. A maximum supply current of 3.6V is available. CPU microprocessors with clock frequencies of 24MHz operate.

MVF30NS152CKU26 Features


ARM? Cortex?-A5 Core
32-Bit Structure

MVF30NS152CKU26 Applications


There are a lot of NXP USA Inc. MVF30NS152CKU26 Microprocessor applications.

  • Torpedo guidance
  • Instrument control
  • Accu-check
  • Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
  • Information appliances (networking of household appliances)
  • Nintendo
  • Auto-breaking system
  • Smoke alarms
  • Blenders
  • Oil and gas