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  • MXD1210C/D

MXD1210C/D

MXD1210C/D datasheet pdf and Memory - Controllers product details from Rochester Electronics, LLC stock available at Utmel


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MXD1210C/D
  • Package: Die
  • Datasheet: PDF
  • Stock: 695
  • Description: MXD1210C/D datasheet pdf and Memory - Controllers product details from Rochester Electronics, LLC stock available at Utmel(Kg)

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Details

Tags

Parameters
Package / Case Die
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish TIN LEAD
Voltage - Supply 4.75V~5.5V
Terminal Position UPPER
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 240
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 8
JESD-30 Code R-XUUC-N8
Qualification Status COMMERCIAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Controller Type Nonvolatile RAM
RoHS Status Non-RoHS Compliant

MXD1210C/D Overview


A package containing materials from Bulk is provided. This information is provided in the Die in order to save space on the board. It is a type of Nonvolatile RAM with high quality and reliable performance. 0°C~70°C should be set as the operating temperature. It is necessary to supply voltage to 4.75V~5.5V in order to ensure normal operation. It is common to use 8 terminations to prevent signals from reflecting off the end of the transmission line. Device supply voltage is 5V. The 8 pins are configured on the board. As a result, the reflow temperature limit of 240 is determined by the component with the lowest tolerance for high temperatures. It is integrated with MICROPROCESSOR CIRCUIT as its uPs/uCs/peripheral IC type.

MXD1210C/D Features


Available in the Die package
Nonvolatile RAM as controller type
Operating temperature of 0°C~70°C

MXD1210C/D Applications


There are a lot of Rochester Electronics, LLC MXD1210C/D Memory Controllers applications.

  • IDE Disk-on-Modules (DoM)
  • Facsimile, Printers and Photocopiers
  • Solid State Disks (SSD)
  • PCMCIA or ATA PC cards
  • Security Flash Drive
  • Embedded modules including U.2, M.2, MO-297 and MO-300
  • SmartCards
  • Multi-Chip-Packages (MCP)
  • Multi-Chip-Package (MCP)
  • Internet Appliances