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  • NCV5702DR2G

NCV5702DR2G

Surface Mount Tape & Reel (TR) Active Gate Drivers ICs Non-Inverting 1 16-SOIC (0.154, 3.90mm Width) Half-Bridge


  • Manufacturer: ON Semiconductor
  • Origchip NO: 598-NCV5702DR2G
  • Package: 16-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 932
  • Description: Surface Mount Tape & Reel (TR) Active Gate Drivers ICs Non-Inverting 1 16-SOIC (0.154, 3.90mm Width) Half-Bridge (Kg)

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Details

Tags

Parameters
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154, 3.90mm Width)
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series Automotive, AEC-Q100
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 20V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Input Type Non-Inverting
Rise / Fall Time (Typ) 9.2ns 7.9ns
Channel Type Synchronous
Number of Drivers 1
Driven Configuration Half-Bridge
Gate Type IGBT
Current - Peak Output (Source, Sink) 1A 1A
Logic Voltage - VIL, VIH 0.75V 4.3V
RoHS Status ROHS3 Compliant

NCV5702DR2G Overview


Its 16-SOIC (0.154, 3.90mm Width) package provides greater flexibility.The packaging method is indicated by Tape & Reel (TR).This configuration includes 1 drivers.Ideally, it should be mounted in the direction of Surface Mount.By using 20V supply voltage, it is able to demonstrate its superiority.Gate type IGBT has been used in its design.Mosfet driver is possible to use this device at temperatures as low as -40°C~125°C TA.Non-Inverting is used as the input type.The gate driver belongs to the Automotive, AEC-Q100 series.

NCV5702DR2G Features


Embedded in the Tape & Reel (TR) package
1 drivers
Employing a gate type of IGBT
Operating with the supply voltage of Automotive, AEC-Q100

NCV5702DR2G Applications


There are a lot of ON Semiconductor NCV5702DR2G gate drivers applications.

  • Portable Media Players
  • Broadcast equipment
  • Commercial and agricultural vehicles (CAV)
  • Digitally controlled power supplies
  • High power buffers
  • Dual-Battery Systems
  • Smart Phones
  • LCD/LCoS/DLP portable and embedded pico projectors
  • Solar power supplies
  • High-speed communications