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PCX755BVZFU300LE

PowerPC Microprocessor PCX755 360-BBGA Exposed Pad


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-PCX755BVZFU300LE
  • Package: 360-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 635
  • Description: PowerPC Microprocessor PCX755 360-BBGA Exposed Pad (Kg)

Purchase & Inquiry

Transport

Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 300MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant

PCX755BVZFU300LE Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 360-BBGA Exposed Pad. High reliability is achieved with advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. The operating temperature around -40°C~110°C TJ should be understood. A PowerPC processor is present in this CPU. I/O is run at 2.5V 3.3V on this CPU. You can search for variants of a microprocessor with PCX755. 360-PBGA (25x25) package is offered by suppliers.

PCX755BVZFU300LE Features


PowerPC Core

PCX755BVZFU300LE Applications


There are a lot of Microchip Technology PCX755BVZFU300LE Microprocessor applications.

  • Projector
  • Leakage current tester
  • Temperature sensing and controlling devices
  • Printers
  • Firewalls
  • Oscilloscopes
  • Smart highways (navigation, traffic control, information monitoring and car service)
  • Toys
  • Industrial control field
  • Heater/Fan