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PCX755BVZFU350LE

PowerPC Microprocessor PCX755 360-BBGA Exposed Pad


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-PCX755BVZFU350LE
  • Package: 360-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 464
  • Description: PowerPC Microprocessor PCX755 360-BBGA Exposed Pad (Kg)

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 360-BBGA Exposed Pad
Supplier Device Package 360-PBGA (25x25)
Operating Temperature -40°C~110°C TJ
Packaging Tray
Published 2006
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX755
Speed 350MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RoHS Status Non-RoHS Compliant

PCX755BVZFU350LE Overview


The embedded microprocessor ships overseas conveniently packed in 360-BBGA Exposed Pad. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. K-40°C~110°C TJw what the operating temperature is around -40°C~110°C TJ. The CPU is powered by a PowerPC core. As far as I/O is concerned, this CPU runs at 2.5V 3.3V. PCX755 is a good way to search for variants of the microprocessor. Suppliers are offering 360-PBGA (25x25) packages.

PCX755BVZFU350LE Features


PowerPC Core

PCX755BVZFU350LE Applications


There are a lot of Microchip Technology PCX755BVZFU350LE Microprocessor applications.

  • Removable disks
  • Firewalls
  • Fire detection & safety devices
  • Smartphones-calling, video calling, texting, email
  • Mobile computers
  • Measurement and control field
  • Smoke alarms
  • DVD\DV\MP3 players
  • Set-top boxes
  • Microwave ovens