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PEB 20532 F V1.3

PEB20532 Telecom device2 Circuits

Manufacturer: Infineon Technologies
Origchip NO: 376-PEB 20532 F V1.3
Package: 100-LQFP
Datasheet: PDF
Stock: 339
Description: PEB20532 Telecom device2 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Packaging	Tray
Series	SEROCCO™
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Power (Watts)	150mW
Voltage - Supply	3V~3.6V
Base Part Number	PEB20532
Function	Serial Optimized Communications Controller
Interface	HDLC, PPP
Number of Circuits	2
Current - Supply	50mA
Mounting Type	Surface Mount
Package / Case	100-LQFP
Supplier Device Package	P-TQFP-100
Operating Temperature	0°C~70°C

PEB 20532 F V1.3 Overview

In order to save space on the board, the 100-LQFP package is used.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.There are 2 circuits in this telecom IC .When 3V~3.6V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Reliable performance can be offered when the operating temperature is set at 0°C~70°C.PEB20532 can be used to locate related parts based on telecom switching's base part number.An electric current of 50mA is supplied to telecom equipment .A lot of its functions of the telecommunication product are similar to those of the electronic parts in the SEROCCO? series.

PEB 20532 F V1.3 Features

Available in the 100-LQFP package

PEB 20532 F V1.3 Applications

There are a lot of Infineon Technologies PEB 20532 F V1.3 Telecom applications.

Interfaces to DS3
CSU/DSU Equipment
T3 channelized access concentrators
T1 Rates PCM Line Interface
High speed data transmission line cards
Fault Tolerant Systems
Fiber In The Loop (FITL)
ISDN Primary Rate Interfaces (PRA)
Remote wireless modules
PBX (Private Branch Exchange)