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PEB 22554 HT V1.3

PEB22554 Telecom device4 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEB 22554 HT V1.3
  • Package: 144-LQFP
  • Datasheet: -
  • Stock: 575
  • Description: PEB22554 Telecom device4 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Series QuadFALC™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 750mW
Voltage - Supply 3.13V~3.46V
Base Part Number PEB22554
Function Framer, Line Interface Unit (LIU)
Interface E1, HDLC, J1, PCM, T1
Number of Circuits 4
Current - Supply 330mA

PEB 22554 HT V1.3 Overview


Space is saved on the board by using the 144-LQFP package.The way of Tray is employed for telecommunications equipment packing.Telecommunications equipment is mounted with type Surface Mount.A 4-circuit composes this telecom IC .3.13V~3.46V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Operating temperatures of -40°C~85°C can ensure reliable performance.By using telecom switching's base part number of PEB22554, it is possible to find more related parts.The current supply is 330mA.There are many similarities between it and the electronic parts of the QuadFALC? series.

PEB 22554 HT V1.3 Features


Available in the 144-LQFP package

PEB 22554 HT V1.3 Applications


There are a lot of Infineon Technologies PEB 22554 HT V1.3 Telecom applications.

  • Stations
  • PBXs channel bank
  • Hybrid fiber coax (HFC)
  • Fiber to the Home (FTTH)
  • Fiber
  • Channel Banks
  • M13 MUX
  • Interfaces to SONET STS-1 Networks
  • Inverse Multiplexing for ATM (IMA)
  • Integrated Access Devices (IADs)