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PEB 3265 H V1.5

PEB3265 Telecom device2 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEB 3265 H V1.5
  • Package: 64-QFP
  • Datasheet: PDF
  • Stock: 747
  • Description: PEB3265 Telecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-QFP
Supplier Device Package P-MQFP-64-1
Operating Temperature 0°C~70°C
Packaging Tray
Series DuSLIC
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Base Part Number PEB3265
Function Dual Channel Subscriber Line Interface Circuit (DuSLIC)
Interface IOM-2, PCM
Number of Circuits 2
Current - Supply 105mA

PEB 3265 H V1.5 Overview


In order to save space on the board, the 64-QFP package is used.For telecommunications equipment packing, the Tray method is used.Telecommunications equipment is mounted using Surface Mount.2 circuits make up this telecom IC .The supply voltage of 3.3V can increase efficiency.Operating temperatures of 0°C~70°C can ensure reliable performance.Telecom switching's base part number of PEB3265 can be used to find more related parts.A 105mA-volt supply current is used to operate telecom equipment .This part can perform many functions similar to the electronic parts under the DuSLIC series.

PEB 3265 H V1.5 Features


Available in the 64-QFP package

PEB 3265 H V1.5 Applications


There are a lot of Infineon Technologies PEB 3265 H V1.5 Telecom applications.

  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Wireless base stations
  • Network Multiplexing and Terminating Equipment
  • T1/E1/J1 Performance Monitoring
  • ATM Switches
  • T1 Rates PCM Line Interface
  • Hybrid fiber coax (HFC)
  • Home Gateway
  • Dual battery supply voltage SLICs
  • PDH Multiplexers