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PEB 3324 E V1.4

PEB3324 Telecom device4 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEB 3324 E V1.4
  • Package: 176-LBGA
  • Datasheet: PDF
  • Stock: 910
  • Description: PEB3324 Telecom device4 Circuits(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 176-LBGA
Supplier Device Package PG-LBGA-176
Operating Temperature -40°C~85°C
Packaging Tray
Series VINETIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 400mW
Base Part Number PEB3324
Function Analog Voice Access
Interface ADPCM
Number of Circuits 4
RoHS Status Non-RoHS Compliant

PEB 3324 E V1.4 Overview


176-LBGA package is used to save board space.Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.This telecom IC is composed of 4 circuits.The operating temperature set at -40°C~85°C can offer reliable performance.Telecom switching's base part number, PEB3324, can be used to find related parts.This part can perform many functions similar to the electronic parts under the VINETIC? series.

PEB 3324 E V1.4 Features


Available in the 176-LBGA package

PEB 3324 E V1.4 Applications


There are a lot of Infineon Technologies PEB 3324 E V1.4 Telecom applications.

  • Microwave transmission systems
  • Add/Drop multiplexers (ADMs)
  • Fault Tolerant Systems
  • PBXs channel bank
  • Fiber
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • SDH/SONET multiplexers
  • E2 Rates PCM Line Interface
  • High speed data transmission line cards
  • ATM equipment with integrated DS1 interfaces