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PEB 3324 HL V1.4

PEB3324 Telecom device4 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEB 3324 HL V1.4
  • Package: 176-LQFP
  • Datasheet: PDF
  • Stock: 655
  • Description: PEB3324 Telecom device4 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 176-LQFP
Supplier Device Package PG-LQFP-176
Operating Temperature -40°C~85°C
Packaging Tray
Series VINETIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 400mW
Base Part Number PEB3324
Function Analog Voice Access
Interface ADPCM
Number of Circuits 4

PEB 3324 HL V1.4 Overview


To save board space, the 176-LQFP package is used.The way of Tray is employed for telecommunications equipment packing.A Surface Mount mounting type is used.An 4-circuit makes up this telecom IC .A -40°C~85°C-temperature setting offers reliable performance.Telecom switching's base part number of PEB3324 can be a method to find more related parts.There are many similarities between it and the electronic parts of the VINETIC? series.

PEB 3324 HL V1.4 Features


Available in the 176-LQFP package

PEB 3324 HL V1.4 Applications


There are a lot of Infineon Technologies PEB 3324 HL V1.4 Telecom applications.

  • Digital loop carrier (DLC)
  • DECT (Digital European Cordless Telephone) Base Stations
  • PDH Multiplexers
  • Private branch exchange (PBX)
  • E1 LAN/WAN Routers
  • Codec function on telephone switch line cards
  • Home Side Box
  • PBX (Private Branch Exchange)
  • Digital Modems
  • Channel Service Units (CSUs): T1/E1/J1