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PEF 20471 E V1.3

PEF20471 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEF 20471 E V1.3
  • Package: 217-BGA
  • Datasheet: PDF
  • Stock: 706
  • Description: PEF20471 Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 217-BGA
Supplier Device Package 217-BGA (23x23)
Operating Temperature -40°C~85°C
Packaging Tray
Series SWITI
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.13V~3.47V
Base Part Number PEF20471
Function Switching IC
Interface PCM, PLL
Number of Circuits 1
Current - Supply 200mA
RoHS Status Non-RoHS Compliant

PEF 20471 E V1.3 Overview


A 217-BGA package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.A Surface Mount mounting type is used.Telecom circuit is made up of 1 circuits.Telecom circuit is possible to increase efficiency by providing 3.13V~3.47V with a higher voltage.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.Telecom switching's base part number of PEF20471 can be used to find more related parts.An electric current of 200mA is supplied to telecom equipment .With the SWITI series electronic parts, it can provide a lot of similar features.

PEF 20471 E V1.3 Features


Available in the 217-BGA package

PEF 20471 E V1.3 Applications


There are a lot of Infineon Technologies PEF 20471 E V1.3 Telecom applications.

  • T1/E1/J1 Multiplexer and Channel Banks
  • DECT (Digital European Cordless Telephone) Base
  • T1 Digital Cross Connects (DSX-1)
  • Short/Medium Loop
  • Inverse Multiplexing for ATM (IMA)
  • Cable modem
  • CSU/DSU Equipment
  • Stations
  • PBX interfaces
  • Router