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PEF 22552 E V1.1

PEF22552 Telecom device2 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEF 22552 E V1.1
  • Package: 160-LBGA
  • Datasheet: PDF
  • Stock: 939
  • Description: PEF22552 Telecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 160-LBGA
Supplier Device Package P/PG-LBGA-160-1
Operating Temperature -40°C~85°C
Packaging Tray
Series DualFALC™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.8V 3.3V
Base Part Number PEF22552
Function Framer, Line Interface Unit (LIU)
Interface E1, HDLC, J1, T1
Number of Circuits 2
RoHS Status Non-RoHS Compliant

PEF 22552 E V1.1 Overview


A 160-LBGA package is used to reduce board space requirements.Packing is done according to the Tray method.The mounting type of this telecom circuit is Surface Mount.A 2-circuit composes this telecom IC .Providing 1.8V 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.By using telecom switching's base part number of PEF22552, it is possible to find more related parts.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the DualFALC? series.

PEF 22552 E V1.1 Features


Available in the 160-LBGA package

PEF 22552 E V1.1 Applications


There are a lot of Infineon Technologies PEF 22552 E V1.1 Telecom applications.

  • Central office (CO)
  • Integrated Access Devices (IADs)
  • PBX interfaces
  • NIU
  • Hybrid fiber coax (HFC)
  • Digital Access Cross-connect System (DACs)
  • Short/Medium Loop
  • Voice over IP/DSL
  • Private branch exchange (PBX)
  • PBXs channel bank