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PEF 3460 E V1.2-G

PEF3460 Telecom device1 Circuits


  • Manufacturer: Infineon Technologies
  • Origchip NO: 376-PEF 3460 E V1.2-G
  • Package: 272-BGA
  • Datasheet: -
  • Stock: 371
  • Description: PEF3460 Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Interface DS3 / E3, E3 / T3, HDLC / PPP
Number of Circuits 1
Mounting Type Surface Mount
Package / Case 272-BGA
Supplier Device Package 272-BGA (27x27)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Base Part Number PEF3460
Function Framer, Line Interface Unit (LIU)

PEF 3460 E V1.2-G Overview


In order to save space on the board, 272-BGA packages are used.Telecommunications equipment is packed using the Tray method.In this case, Surface Mount is the mounting type.A 1-circuit composes this telecom IC .When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.-40°C~85°C is the operating temperature that can be set for reliable performance.PEF3460 is the base part number, which can be used to find more related parts.

PEF 3460 E V1.2-G Features


Available in the 272-BGA package

PEF 3460 E V1.2-G Applications


There are a lot of Infineon Technologies PEF 3460 E V1.2-G Telecom applications.

  • PDH Multiplexers
  • Cable Modem
  • ISDN NT1/TA
  • Microwave transmission systems
  • M13 MUX
  • E1 Multiplexer
  • Digital Access Cross-connect System (DACs)
  • PCM channel bank
  • ATM Switches
  • Digital loop carrier (DLC)