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  • QS7201-25SO

QS7201-25SO

28 TerminationsFIFO memory IC4.5K 512 x 925ns


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-QS7201-25SO
  • Package: -
  • Datasheet: -
  • Stock: 105
  • Description: 28 TerminationsFIFO memory IC4.5K 512 x 925ns (Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 28
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code R-PDSO-G28
Function Asynchronous
Current - Supply (Max) 60mA
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 4.5K 512 x 9
Access Time 25ns
Data Rate 28MHz
Organization 512X9
Memory Width 9
Memory Density 4608 bit
Parallel/Serial PARALLEL
Retransmit Capability Yes
Programmable Flags Support No
Output Enable NO
Expansion Type Depth, Width
Cycle Time 35 ns
RoHS Status ROHS3 Compliant

QS7201-25SO Overview


You'll find it packaged in the shape of a Bulk .The FIFO chips have a memory of 4.5K 512 x 9 that can be used to store applications and data.Keeping the temperature at 0°C~70°C will ensure reliable operation.This FIFO products can operate at a maximum operating supply current of 60mA .When the supply voltage is 5V , high efficiency is possible.As a result of this, FIFO means contains 28 terminations.Additionally, RETRANSMIT can be generated with this FIFO memory.As a result, Vsup is set at 5.5V (FIFO memory IC's maximum voltage supply).In order to ensure normal operation, the supply voltage (Vsup) should be kept above 4.5V .

QS7201-25SO Features


4.5K 512 x 9 memory size

QS7201-25SO Applications


There are a lot of Rochester Electronics, LLC QS7201-25SO FIFOs Memory applications.

  • Routers
  • HDD
  • Notebook
  • Seismic Data Collection at Extreme Temperatures
  • Portable Information Devices
  • Code converters
  • SPI Bus Flash Memory Devices
  • General Data Collection Applications at Extreme High-Temperatures
  • Network bridges
  • Consumer Systems