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QS7201-50Q

28 TerminationsFIFO memory IC4.5K 512 x 950ns


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-QS7201-50Q
  • Package: -
  • Datasheet: -
  • Stock: 220
  • Description: 28 TerminationsFIFO memory IC4.5K 512 x 950ns (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 28
ECCN Code EAR99
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT
HTS Code 8542.32.00.71
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code R-PDSO-G28
Function Asynchronous
Current - Supply (Max) 60mA
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 4.5K 512 x 9
Access Time 50ns
Data Rate 15MHz
Organization 512X9
Memory Width 9
Memory Density 4608 bit
Parallel/Serial PARALLEL
Retransmit Capability Yes
Programmable Flags Support No
Output Enable NO
Expansion Type Depth, Width
Cycle Time 65 ns
RoHS Status ROHS3 Compliant

QS7201-50Q Overview


You'll find it packaged in the shape of a Bulk .There is a memory of 4.5K 512 x 9 on the FIFO chip that can be used to store applications and data.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .The mounting type of the FIFO memory is Surface Mount .For operation, a voltage of 4.5V~5.5V is used.60mA is memory IC's maximum operating supply current.With a supply voltage of 5V volts, high efficiency is possible.As a result of this, FIFO means contains 28 terminations.With the help of this FIFO memory, RETRANSMIT can also be generated.The FIFO memory IC's maximum supply voltage is set to 5.5V .The supply voltage (Vsup) should remain above 4.5V to ensure normal operation.

QS7201-50Q Features


4.5K 512 x 9 memory size

QS7201-50Q Applications


There are a lot of Rochester Electronics, LLC QS7201-50Q FIFOs Memory applications.

  • Networking
  • Rate buffers
  • Emulators
  • MP3 Interface for Automobile
  • Fabrication Site
  • Thermal Management for DDR3 Memory Modules
  • SPD for DDR3 Memory Modules
  • Measurement Equipment
  • Portable Information Devices
  • Cameras