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  • QS72225-25TF

QS72225-25TF

64 TerminationsFIFO memory IC18K 1K x 1815ns


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-QS72225-25TF
  • Package: 64-QFP
  • Datasheet: -
  • Stock: 830
  • Description: 64 TerminationsFIFO memory IC18K 1K x 1815ns (Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-QFP
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 64
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code S-PQFP-G64
Function Synchronous
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 18K 1K x 18
Access Time 15ns
Organization 1KX18
Memory Width 18
Memory Density 18432 bit
Parallel/Serial PARALLEL
Retransmit Capability No
Programmable Flags Support Yes
Output Enable YES
Cycle Time 25 ns
RoHS Status ROHS3 Compliant

QS72225-25TF Overview


64-QFP is the package in which FIFO memory chip is contained.It comes in a Bulk package.The FIFO chips have a memory of 18K 1K x 18 that can be used to store applications and data.A temperature regulation of 0°C~70°C is crucial for reliable operation.There is Surface Mount mounting type for this FIFO memory.High efficiency is possible with a supply voltage of 5V .A total of 64 terminations are contained within FIFO means.Using this gadget, RETRANSMIT can also be generated.As a result, Vsup is set at 5.5V (FIFO memory IC's maximum voltage supply).In order to ensure normal operation, the supply voltage (Vsup) should be kept above 4.5V .

QS72225-25TF Features


18K 1K x 18 memory size

QS72225-25TF Applications


There are a lot of Rochester Electronics, LLC QS72225-25TF FIFOs Memory applications.

  • High-speed disk
  • IP Camera Buffer
  • Buses
  • MP3 Interface for Automobile
  • Data communications
  • Communications
  • Network switching/routing
  • Extended product life cycle
  • Signal processing
  • High-speed graphics pixel buffer