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QS723621-30TF

144 TerminationsFIFO memory IC72K 2K x 3630ns


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-QS723621-30TF
  • Package: 144-QFP
  • Datasheet: -
  • Stock: 383
  • Description: 144 TerminationsFIFO memory IC72K 2K x 3630ns (Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-QFP
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Number of Terminations 144
Terminal Finish TIN LEAD
Additional Feature RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 5V
JESD-30 Code S-PQFP-G144
Function Synchronous
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4.5V
Memory Size 72K 2K x 36
Access Time 30ns
Organization 2KX36
Memory Width 36
Memory Density 73728 bit
Parallel/Serial PARALLEL
FWFT Support No
Programmable Flags Support Yes
Output Enable YES
Cycle Time 30 ns
RoHS Status ROHS3 Compliant

QS723621-30TF Overview


You can find FIFO memory chip in package 144-QFP .Bulk case is used for packaging.Data and applications can be stored in the FIFO chip's 72K 2K x 36 memory.It is recommended that the temperature be regulated to 0°C~70°C to ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.When the supply voltage is 5V there is the possibility of high efficiency.FIFO means contains 144 terminations.Using this gadget, RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX can also be generated.Voltage FIFO memory IC's maximum is set to 5.5V .The supply voltage (Vsup) should remain above 4.5V to ensure normal operation.

QS723621-30TF Features


72K 2K x 36 memory size

QS723621-30TF Applications


There are a lot of Rochester Electronics, LLC QS723621-30TF FIFOs Memory applications.

  • Microprogramming
  • Battery Charger
  • Laser Receiver System
  • Computers
  • General Data Collection Applications at Low-Temperatures
  • Extended product-change notification
  • Thermal Management for DDR3 Memory Modules
  • IP Camera Buffer
  • Switches
  • Cardiac Monitoring Device