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  • SE97TK,118

SE97TK,118

8-VFDFN Exposed Pad Thermal Management


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SE97TK,118
  • Package: 8-VFDFN Exposed Pad
  • Datasheet: PDF
  • Stock: 928
  • Description: 8-VFDFN Exposed Pad Thermal Management (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-VFDFN Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Cut Tape (CT)
Published 2009
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory Other Sensors
Voltage - Supply 3V~3.6V
Reach Compliance Code unknown
Base Part Number SE97
Function Temp Monitoring System (Sensor), DIMM DDR Memory
Body Length or Diameter 3mm
Body Breadth 3 mm
Output Type I2C/SMBus
Power Supplies 1.8/3.3V
Termination Type SOLDER
Number of Bits 11
Accuracy ±3°C(Max)
Topology ADC (Sigma Delta), Comparator, Register Bank
Sensor Type Internal
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Housing PLASTIC
Output Interface Type 2-WIRE INTERFACE
Output Alarm Yes
Sensing Temperature -40°C~125°C
Body Height 0.85mm
RoHS Status ROHS3 Compliant

SE97TK,118 Overview


Materials provided by Cut Tape (CT) were used to package the goods.A Type I2C/SMBus output is used.Electronic industry professionals are familiar with the 8-VFDFN Exposed Pad because of its low package cost.Thermal management can act as Temp Monitoring System (Sensor), DIMM DDR Memory.The mounting is done in the Surface Mount-direction.The type is Internal.In order for a system to operate reliably, the temperature should remain at -40°C~125°C.Provide 3V~3.6V supply voltage for normal operation.Temperature can be measured in -40°C~125°C's sensing area.This Base Part Number (SE97) identifies the product's type, regardless of its package, temperature, or other variations.You can find 8 terminations.You can store information in 11 bits.Thermal management belongs to the Other Sensors Subcategory.Thermal management uses SOLDER as Thermal managements termination Type to minimie signal reflections, and power losses. 2-WIRE INTERFACE is able to convert digital signals into analog signals.

SE97TK,118 Features


Available in the 8-VFDFN Exposed Pad package

SE97TK,118 Applications


There are a lot of NXP USA Inc. SE97TK,118 applications of thermal management.

  • Dual In-line Memory Module (DIMM)
  • Servers and Personal Computers
  • Servers
  • DIMM Modules
  • Networking
  • Networking Equipment
  • Protection for Linear-Controlled Fans
  • DIMM Modules for Servers, PCs, and Laptops
  • Projectors
  • Desktop PCs