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  • SE97TL,128

SE97TL,128

8-XFDFN Exposed Pad Thermal Management


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SE97TL,128
  • Package: 8-XFDFN Exposed Pad
  • Datasheet: PDF
  • Stock: 886
  • Description: 8-XFDFN Exposed Pad Thermal Management (Kg)

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The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-XFDFN Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin (Sn)
Voltage - Supply 3V~3.6V
Reach Compliance Code unknown
Base Part Number SE97
Function Temp Monitoring System (Sensor), DIMM DDR Memory
Body Length or Diameter 3mm
Body Breadth 2 mm
Output Type I2C/SMBus
Termination Type SOLDER
Number of Bits 11
Accuracy ±3°C(Max)
Topology ADC (Sigma Delta), Comparator, Register Bank
Sensor Type Internal
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Housing PLASTIC
Output Interface Type 2-WIRE INTERFACE
Output Alarm Yes
Sensing Temperature -40°C~125°C
Body Height 0.5mm
RoHS Status ROHS3 Compliant

SE97TL,128 Overview


Materials were packaged in accordance with Tape & Reel (TR)'s specifications.As an output type, it uses I2C/SMBus.Its low package cost makes it familiar to those in the electronics industry.Thermal management can act as Temp Monitoring System (Sensor), DIMM DDR Memory.There is a device mounted in the way of Surface Mount.Thermal management has a Type Internal.The temperature should be kept at -40°C~125°C to maintain reliable operation.Thermal management should be able to function normally if 3V~3.6V Supply Voltage is provided.The sensing temperature of -40°C~125°C can be measured.This Base Part Number (SE97) identifies the product's type, regardless of its package, temperature, or other variations.11 bits of information can be stored.The SOLDER termination type minimiSOLDERes power losses and reflections.2-WIRE INTERFACE is capable of converting digital signals into analog ones.

SE97TL,128 Features


Available in the 8-XFDFN Exposed Pad package

SE97TL,128 Applications


There are a lot of NXP USA Inc. SE97TL,128 applications of thermal management.

  • Networking Equipment
  • Workstations
  • DIMM Modules
  • Power Supplies
  • Desktop PCs
  • Multi-processor based equipment
  • Industrial ApplicationsDIMM Modules for Servers, PCs, and Laptops
  • Industrial Equipment
  • Test Equipment Instruments
  • Telecomm Equipment