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  • SI3225-BQ

SI3225-BQ

64 Terminations64 Pin SI3225 Telecom device2 Circuits


  • Manufacturer: Silicon Labs
  • Origchip NO: 715-SI3225-BQ
  • Package: 64-TQFP
  • Datasheet: PDF
  • Stock: 875
  • Description: 64 Terminations64 Pin SI3225 Telecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-TQFP
Number of Pins 64
Operating Temperature -40°C~85°C
Packaging Tray
Published 1998
Series ProSLIC®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
Max Power Dissipation 941mW
Technology CMOS
Voltage - Supply 3.3V 5V
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Base Part Number SI3225
Function Subscriber Line Interface Concept (SLIC), CODEC
Qualification Status Not Qualified
Interface GCI, PCM, SPI
Number of Circuits 2
Operating Supply Current 65mA
Nominal Supply Current 22mA
Length 10mm
Width 10mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

SI3225-BQ Overview


A 64-TQFP package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.Mounting type Surface Mount is used.The telecom IC is composed of 2 circuits.When 3.3V 5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A temperature setting of -40°C~85°C ensures reliable performance.Telecom switching is mounted in a Surface Mount-direction.There are 64 terminations can be found in telecom switching configuration.The voltage it operates at is 3.3V.The telecom interface has 64 pins.Telecom switching's base part number of SI3225 can be a method to find more related parts.A designer can make use of this telecom circuit by operating with the 65mA supply current.This part can perform many functions similar to the electronic parts under the ProSLIC? series.

SI3225-BQ Features


Available in the 64-TQFP package
Operating supply current of 65mA

SI3225-BQ Applications


There are a lot of Silicon Labs SI3225-BQ Telecom applications.

  • Interfaces to SONET STS-1 Networks
  • Dual battery supply voltage SLICs
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Integrated Access Devices (IADs)
  • NIU
  • Digital Cross Connect Systems
  • Cross Connects
  • Digital Cross-Connect Systems
  • Cable Modem
  • Channel Banks