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SI32266-C-FM1
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| Parameters | |
|---|---|
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tray |
| Published | 2014 |
| Series | ProSLIC® |
| Part Status | Active |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
SI32266-C-FM1 Overview
A QFN package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.1 circuits are used in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.Telecom switching is mounted in the way of Surface Mount.It uses the DIGITAL SLIC IC type for its telecom IC.It is able to provide a lots of similar functions of the telecommunication product with the electronic parts under the ProSLIC? series.
SI32266-C-FM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32266-C-FM1 Applications
There are a lot of Silicon Labs SI32266-C-FM1 Telecom applications.
- PCM Test Equipment
- Home Side Box
- Cross Connects
- CSU/DSU Equipment
- Cable modem
- E1 Network Equipment
- T1/E1/J1 Multiplexer and Channel Banks
- Digital Cross Connect Systems
- SDH/SONET multiplexers
- Residential Gateways