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SI3232-BQ

64 TerminationsSI3232 Telecom device2 Circuits


  • Manufacturer: Silicon Labs
  • Origchip NO: 715-SI3232-BQ
  • Package: 64-TQFP
  • Datasheet: -
  • Stock: 107
  • Description: 64 TerminationsSI3232 Telecom device2 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 64-TQFP
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64
Terminal Finish TIN LEAD
Power (Watts) 280mW
Technology CMOS
Voltage - Supply 3.13V~3.47V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number SI3232
JESD-30 Code S-PQFP-G64
Function Subscriber Line Interface Concept (SLIC)
Qualification Status Not Qualified
Interface ISDN
Number of Circuits 2
Current - Supply 28mA
Length 10mm
Width 10mm
RoHS Status Non-RoHS Compliant

SI3232-BQ Overview


A 64-TQFP package saves space on a board.For telecommunications equipment packing, the Tray method is used.The mounting type of this telecom circuit is Surface Mount.2 circuits make up this telecom IC .3.13V~3.47V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The operating temperature set at 0°C~70°C can offer reliable performance.As part of its configuration, it includes 64 terminations.It requires a supply voltage of 3.3V.SI3232 is the base part number, which can be used to find more related parts.28mA is the supply current.

SI3232-BQ Features


Available in the 64-TQFP package

SI3232-BQ Applications


There are a lot of Silicon Labs SI3232-BQ Telecom applications.

  • E1 LAN/WAN Routers
  • NIU
  • PBXs channel bank
  • Digital access cross connects
  • Wireless local loop (WLL)
  • Fiber Optic Terminals
  • T1/E1/J1 Multiplexer and Channel Banks
  • Multichannel DS1 Test Equipment
  • Digital cross connects (DSX-1)
  • DECT (Digital European Cordless Telephone) Base