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  • SM320VC5409GGU10EP

SM320VC5409GGU10EP

CPLD TMS320C54x Series 144-LFBGA


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-SM320VC5409GGU10EP
  • Package: 144-LFBGA
  • Datasheet: -
  • Stock: 552
  • Description: CPLD TMS320C54x Series 144-LFBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-LFBGA
Supplier Device Package 144-BGA MICROSTAR (12x12)
Operating Temperature -40°C~100°C TA
Packaging Tray
Series TMS320C54x
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Interface McBSP
Voltage - I/O 3.30V
Non-Volatile Memory ROM (32kB)
Voltage - Core 1.80V
On Chip Data RAM 64kB
Clock Rate 100MHz
RoHS Status Non-RoHS Compliant

SM320VC5409GGU10EP Overview


This is an electronic component with a 144-LFBGA package.A packaging way of Tray is provided.As a member of Fixed Point, it is ideally suitable for a wide range of applications.Surface Mount is mounted in a manner that allows it to be moved.It is important that the device is operated at a temperature of -40°C~100°C TA in order to ensure its normal functioning.As the name implies, the analog voltage range of 3.30V refers to the voltage that can be inserted or removed.There are several digital signal processors in the TMS320C54x series, including this one.

SM320VC5409GGU10EP Features


Supplied in the 144-LFBGA package

SM320VC5409GGU10EP Applications


There are a lot of Rochester Electronics, LLC SM320VC5409GGU10EP DSP applications.

  • Other sensor array processing
  • Audio compression
  • Electronic information engineering
  • Biomedical treatment
  • Sonar
  • Real-time effects
  • Radio detection and rangin systems
  • Vibration signal processing
  • Boats
  • Digital image processing, data compression