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SN74ABT7820-15PN

FIFO memory IC74ABT Series 18K 512 x 18 x 212ns


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-SN74ABT7820-15PN
  • Package: 80-LQFP
  • Datasheet: PDF
  • Stock: 563
  • Description: FIFO memory IC74ABT Series 18K 512 x 18 x 212ns (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 80-LQFP
Supplier Device Package 80-LQFP (12x12)
Operating Temperature 0°C~70°C
Packaging Tray
Series 74ABT
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.5V~5.5V
Function Asynchronous
Current - Supply (Max) 95mA
Memory Size 18K 512 x 18 x 2
Access Time 12ns
Data Rate 67MHz
Bus Directional Bi-Directional
Retransmit Capability No
FWFT Support No
Programmable Flags Support Yes
RoHS Status ROHS3 Compliant

SN74ABT7820-15PN Overview


80-LQFP is a package that contains FIFO memory chip.Tray case is used for packaging.There is a 18K 512 x 18 x 2 MB memory on the FIFO chips, which can be used to store both applications and data.The temperature should be kept at 0°C~70°C to ensure reliable operation.Mounting type Surface Mount is assigned to the FIFO memory.For operation, a voltage of 4.5V~5.5V is used.It is a component from the 74ABT series.95mA is the FIFO's maximum operating supply current.

SN74ABT7820-15PN Features


18K 512 x 18 x 2 memory size
74ABT series

SN74ABT7820-15PN Applications


There are a lot of Rochester Electronics, LLC SN74ABT7820-15PN FIFOs Memory applications.

  • Down-Hole Energy Drilling
  • Switches
  • Extended product-change notification
  • Networking
  • Firmware loaders
  • Desktop Computers
  • Alarm System
  • Seismic Data Collection at Extreme Temperatures
  • Temporary storage elements
  • Network bridges