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  • SPD08-200-L-RB-TR

SPD08-200-L-RB-TR

SPD08-200-L-RB-TR datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at Utmel


  • Manufacturer: 3M
  • Origchip NO: 2-SPD08-200-L-RB-TR
  • Package: -
  • Datasheet: PDF
  • Stock: 582
  • Description: SPD08-200-L-RB-TR datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from 3M stock available at Utmel(Kg)

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Details

Tags

Parameters
Contact Material Copper Alloy
Contact Plating Gold
Mount Surface Mount
Mounting Type Surface Mount
Housing Material Polymer
Material - Insulation Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Published 2011
Series SPD08
Feature Board Guide, Latches
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Cantilever
Number of Positions 200
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2
Gender Female
Voltage - Rated 50V
Contact Type Cantilever
Pitch 0.031 0.80mm
Current Rating 3A
Contact Finish Gold
Card Type Non Specified - Dual Edge
Read Out Dual
Contact Finish Thickness 30.0μin 0.76μm
Card Thickness 0.062 1.57mm
RoHS Status RoHS Compliant

SPD08-200-L-RB-TR Overview


The material was packaged in accordance with Tape & Reel (TR)'s specifications.It's recommended to mount type Surface Mount.Connection to the device is made through the connector socket Cantilever.The device has Board Guide, Latches features.SPD08 tells you the series of the device.For stable operation, the maximum operating temperature is 125°C°C.For reliability, it needs to be at -55°C degrees Celsius.

SPD08-200-L-RB-TR Features


SPD08 series

SPD08-200-L-RB-TR Applications


There are a lot of 3M SPD08-200-L-RB-TR Edgeboard Connectors applications.

  • Multicarrier, multimode digital receivers
  • Industrial Process Control
  • GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
  • Uninterrupted Power Supplies
  • Micro and pico cell systems, software radios
  • Instrumentation and test equipment
  • CMOS Image sensors for mobile applications
  • Scientific instruments
  • 4-channel data acquisition
  • Digital beam-forming systems for ultrasound