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SSTU32865ET/G,551

28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTU32865 0.65mm 1.7V~1.9V 160-TFBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SSTU32865ET/G,551
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: 388
  • Description: 28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTU32865 0.65mm 1.7V~1.9V 160-TFBGA (Kg)

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Details

Tags

Parameters
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number 74SSTU32865
Pin Count 160
JESD-30 Code R-PBGA-B160
Qualification Status Not Qualified
Number of Bits 28
Output Characteristics OPEN-DRAIN
Logic Type 1:2 Registered Buffer with Parity
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 2.15 ns
fmax-Min 270 MHz
Height Seated (Max) 1.2mm
Length 13mm
Width 9mm
RoHS Status ROHS3 Compliant
Mounting Type Surface Mount
Package / Case 160-TFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 1.7V~1.9V

SSTU32865ET/G,551 Overview


A packaging method that uses Tray is employed.It is included in package 160-TFBGA.In order to ensure that the device will work normally, the voltage 1.7V~1.9V is supplied.As a type of electronic component, it uses the Surface Mount mounting method.In terms of its operating temperature, it is set at 0°C~70°C.Using the memory, information is stored in 28 bits.In addition to its base part number 74SSTU32865, other related parts are available.It adds up to 160 when all component pins are added together.With 160 terminations, signals won't reflect off the end of the transmission line.

SSTU32865ET/G,551 Features



SSTU32865ET/G,551 Applications


There are a lot of NXP USA Inc. SSTU32865ET/G,551 Specialty Logic ICs applications.

  • Solenoids
  • Remote controls
  • Bar, KTV wireless entertainment
  • Indoor ad hoc meeting
  • Changeing the frequency from IF to RF
  • interconnection between switches
  • Lamps
  • Wireless showroom
  • Switching system
  • Cell phones