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SSTUA32S865ET,518

28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUA32S865 0.65mm 1.7V~2V 160-TFBGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SSTUA32S865ET,518
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: 472
  • Description: 28 Bit 1:2 Registered Buffer with Parity 0°C~70°C Specialty Logic IC 74SSTUA32S865 0.65mm 1.7V~2V 160-TFBGA (Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 160-TFBGA
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Published 2007
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1
Supply Voltage 1.7V~2V
Terminal Pitch 0.65mm
Base Part Number 74SSTUA32S865
Pin Count 160
JESD-30 Code R-PBGA-B160
Qualification Status Not Qualified
Number of Bits 28
Output Characteristics OPEN-DRAIN
Logic Type 1:2 Registered Buffer with Parity
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 1.8 ns
fmax-Min 450 MHz
Height Seated (Max) 1.2mm
Length 13mm
Width 9mm
RoHS Status ROHS3 Compliant

SSTUA32S865ET,518 Overview


It is used to package items using Tape & Reel (TR).The 160-TFBGA package contains it.It is necessary to supply voltage 1.7V~2V to ensure that the device is capable of operating normally.It is a type of electronic part mounted in the way of Surface Mount.The operating temperature is set to 0°C~70°C.Memory has a bit size of 28.In addition to its base part number 74SSTUA32S865, other related parts are available.All component pins add up to 160.The 160 terminations prevent signals from reflecting off the end of the transmission line.

SSTUA32S865ET,518 Features



SSTUA32S865ET,518 Applications


There are a lot of NXP USA Inc. SSTUA32S865ET,518 Specialty Logic ICs applications.

  • IPTV front end
  • Wireless HD Photography
  • Gigabit Ethernet
  • Televisions
  • Bar, KTV wireless entertainment
  • Desktop PC
  • Optical sub-assembly (OSA)
  • Cordless telephone
  • Thermal management
  • Data center