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SSTV16859BS,151

13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTV Series 74SSTV16859 0.5mm 2.3V~2.7V 56-VFQFN Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-SSTV16859BS,151
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 881
  • Description: 13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTV Series 74SSTV16859 0.5mm 2.3V~2.7V 56-VFQFN Exposed Pad (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 56-VFQFN Exposed Pad
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 2002
Series 74SSTV
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 56
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1
Supply Voltage 2.3V~2.7V
Terminal Pitch 0.5mm
Base Part Number 74SSTV16859
Pin Count 56
JESD-30 Code S-PQCC-N56
Qualification Status Not Qualified
Number of Bits 13, 26
Logic Type Registered Buffer with SSTL_2 Compatible I/O for DDR
Output Polarity TRUE
Trigger Type POSITIVE EDGE
Propagation Delay (tpd) 2.8 ns
fmax-Min 200 MHz
Height Seated (Max) 1mm
Length 8mm
Width 8mm
RoHS Status ROHS3 Compliant

SSTV16859BS,151 Overview


It is used to package items using Tray.It is accessible to the 56-VFQFN Exposed Pad package.For the device to function normally, voltage 2.3V~2.7V is supplied.This electronic part is mounted by using the Surface Mount method.This device operates at a temperature of 0°C~70°C.To store information, the memory has a size of 13, 26 bits.There are a number of similarities among the electronic parts of the 74SSTV series.Based on its base part number 74SSTV16859, related parts can be found.Adding up all component pins equals 56.Signals are prevented from reflecting off the end of the transmission line through 56 terminations.

SSTV16859BS,151 Features



SSTV16859BS,151 Applications


There are a lot of NXP USA Inc. SSTV16859BS,151 Specialty Logic ICs applications.

  • Carrier phase observations
  • Shortwave receiver
  • interconnection between switches
  • Indoor ad hoc meeting
  • transmission relay
  • VoIP phones
  • Precision geodetic measurement
  • Copper and fiber optic cables connection network
  • Laser diode bonding
  • Wireless multimedia center in smart home